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Ultrasonic microscope Product List

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Ultrasonic Microscope 'SAM'

Non-destructive observation is possible! It is effective in detecting defects in internal conditions and adhesion states!

We would like to introduce our ultrasonic microscope, the SAM (Scanning Acoustic Microscope). It is highly effective in detecting defects in the internal conditions and adhesion states of semiconductor packages, substrates, and electronic components. Observation can be performed non-destructively, and defects such as delamination can be detected from the reflected waves of the ultrasonic waves incident on the sample. 【Specifications (excerpt)】 ■ Pulse Receiver: 500MHz ■ Observation Methods: Supports both reflection and transmission methods ■ Acoustic Lenses/Reflection Method: 15, 25, 30, 50, 80, 100, 230MHz ■ Acoustic Lenses/Transmission Method: 15, 25, 30, 50, 100MHz *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
Price：Other

Measurement and Analysis Equipment
Ultrasonic microscope

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Ultrasonic microscope observation of semiconductor packages

Ultrasonic microscope observation of transistors! It is possible to check the delamination conditions at various locations even at the same focus.

We would like to introduce the ultrasonic microscope observation of semiconductor packages that we conduct. Due to storage conditions and mounting conditions, delamination can occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be confirmed from the appearance. By using an ultrasonic microscope, we can clearly capture the internal structure of the package and contribute to reliability evaluation. 【Features】 ■ Ultrasonic microscope observation from the chip side - By changing the focal position, areas that were previously not visible can be seen, even with the same sample. ■ Ultrasonic microscope observation from the die pad side - Delamination conditions can be confirmed at various locations, even with the same focus. *For more details, please download the PDF or feel free to contact us.

Company：アイテス
Price：Other

Analysis and prediction system
Ultrasonic microscope

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[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy

If it is something that ultrasound can penetrate, you can check internal information that cannot be confirmed from the appearance!

Here is an introduction to a case study observing the adhesive condition through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the exterior, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details on the observations and results. [Case Overview] - Observation of the adhesive layer between the metal and the chip - Observation of the adhesion condition between the metal and the adhesive *For more details, please download the PDF or feel free to contact us.